Sensors 2015, 15, 32079–32122
67.
Macdonald, E.; Salas, R.; Espalin, D.; Perez, M.; Aguilera, E.; Muse, D.; Wicker, R.B. 3D Printing for the Rapid
Prototyping of Structural Electronics. IEEE Access 2014, 2, 234–242. [CrossRef]
68.
Khajavi, S.H.; Partanen, J.; Holmström, J. Additive manufacturing in the spare parts supply chain.
Comput. Ind. 2014, 65, 50–63. [CrossRef]
69. Vujovi´c, I. The Introduction of 3D Printing into the Maritime Industry. Trans. Marit. Sci. 2015, 04, 86–87.
70.
Isaza, P.J.F.; Aumund-Kopp, C. Additive Manufacturing Approaches. In Structural Materials and Processes in
Transportation; Lehmhus, D., Busse, M., Herrmann, A.S., Kayvantash, K., Eds.; Wiley-VCH Verlag GmbH &
Co. KGaA: Weinheim, Germany, 2013; pp. 549–566.
71.
Lang, W.; Jakobs, F.; Tolstosheeva, E.; Sturm, H.; Ibragimov, A.; Kesel, A.; Lehmhus, D.; Dicke, U. From
embedded sensors to sensorial materials—The road to function scale integration. Sens. Actuators Phys.
2011
,
171, 3–11. [CrossRef]
72.
Dumstorff, G.; Paul, S.; Lang, W. Integration Without Disruption: The Basic Challenge of Sensor Integration.
IEEE Sens. J. 2014, 14, 2102–2111. [CrossRef]
73. Chortos, A.; Bao, Z. Skin-inspired electronic devices. Mater. Today 2014, 17, 321–331. [CrossRef]
74.
Seminara, L.; Pinna, L.; Ibrahim, A.; Noli, L.; Caviglia, S.; Gastaldo, P. Towards integrating intelligence in
electronic skin. Mechatronics 2015. in press. [CrossRef]
75.
McEvoy, M.A.; Correll, N. Materials that couple sensing, actuation, computation, and communication.
Science 2015, 347, 1261689. [CrossRef] [PubMed]
76.
Parteli, E.J.R. DEM simulation of particles of complex shapes using the multisphere method: Application for
additive manufacturing. Friedrich-Alexander-Univ. Erlangen-Nürnberg FAU 2013, 1542, 185–188.
77.
Kumar, S.; Kruth, J.-P. Composites by rapid prototyping technology. Mater. Des.
2010
, 31, 850–856. [CrossRef]
78.
Vaezi, M.; Chianrabutra, S.; Mellor, B.; Yang, S. Multiple material additive manufacturing.
Virtual Phys. Prototyp. 2013, 8, 19–50. [CrossRef]
79.
Guo, N.; Leu, M.C. Additive manufacturing: Technology, applications and research needs.
Front. Mech. Eng.
2013, 8, 215–243. [CrossRef]
80.
Weiss, L.E.; Merz, R.; Prinz, F.B.; Neplotnik, G.; Padmanabhan, P.; Schultz, L.; Ramaswami, K. Shape
deposition manufacturing of heterogeneous structures. J. Manuf. Syst. 1997, 16, 239–248. [CrossRef]
81.
Godlinski, D.; Morvan, S. Steel Parts with Tailored Material Gradients by 3D-Printing Using Nano-Particulate
Ink. In Materials Science Forum; Trans Tech Publications Ltd.: Uetikon-Zürich, Switzerland, 2005.
82.
Maiwald, M.; Werner, C.; Zöllmer, V.; Busse, M. INKtelligent printing
r
for sensorial applications.
Sens. Rev.
2010, 30, 19–23. [CrossRef]
83.
Zöllmer, V.; Pál, E.; Maiwald, M.; Werner, C.; Godlinski, D.; Lehmhus, D. Functional materials for printed
sensor structures. In Proceedings of the 1st Joint International Symposium on System-Integrated Intelligence
2012, Hannover, Germany, 22–29 June 2012.
84.
Hoerber, J.; Glasschroeder, J.; Pfeffer, M.; Schilp, J.; Zaeh, M.; Franke, J. Approaches for Additive
Manufacturing of 3D Electronic Applications. Procedia CIRP 2014, 17, 806–811. [CrossRef]
85.
Paulsen, J.A.; Renn, M.; Christenson, K.; Plourde, R. Printing conformal electronics on 3D structures with
Aerosol Jet technology. In Proceedings of the 2012 Future of Instrumentation International Workshop (FIIW),
Gatlinburg, TN, USA, 8–9 October 2012.
86.
Shemelya, C.; Cedillos, F.; Aguilera, E.; Espalin, D.; Muse, D.; Wicker, R.; MacDonald, E. Encapsulated
Copper Wire and Copper Mesh Capacitive Sensing for 3-D Printing Applications. IEEE Sens. J.
2015
, 15,
1280–1286. [CrossRef]
87.
Li, J.; Monaghan, T.; Masurtschak, S.; Bournias-Varotsis, A.; Friel, R.J.; Harris, R.A. Exploring the mechanical
strength of additively manufactured metal structures with embedded electrical materials. Mater. Sci. Eng. A
2015, 639, 474–481. [CrossRef]
88.
Joe Lopes, A.; MacDonald, E.; Wicker, R.B. Integrating stereolithography and direct print technologies for
3D structural electronics fabrication. Rapid Prototyp. J. 2012, 18, 129–143. [CrossRef]
89.
Johander, P.; Haasl, S.; Persson, K.; Harrysson, U. Layer Manufacturing as a Generic Tool for Microsystem
Integration. In Proceedings of the Third International Conference on Multi-Material Micro Manufacture,
Borovets, Bulgaria, 3–5 October 2007.
90.
Voxel8—3D Printed Electronics. Available online: http://www.voxel8.co/ (accessed on 17 December 2015).
91.
Rachel, G. Trends in Commercial 3D Printing and Additive Manufacturing. 3D Print. Addit. Manuf.
2015
, 2,
89–90.
32119